IGBT Water Cooling Plate

Product introduction

IGBT water cooling plate is mainly composed of metal cooling substrate, cooling pipe and water inlet and outlet components. The cooling substrate is usually made of aluminum alloy or copper alloy material with high thermal conductivity to ensure that the heat generated by the IGBT module can be quickly conducted out. Cooling pipes are generally copper or stainless steel pipes, which are embedded inside the substrate or attached to the surface of the substrate through a carefully designed layout (such as serpentine, parallel, etc.) to form a coolant circulation channel. The coolant (such as water, glycol solution, etc.) circulates in the pipeline under the drive of the external circulating pump, absorbs heat and then dissipates the heat to the surrounding environment through the external radiator, so as to achieve efficient heat dissipation of the IGBT module, maintain it in the appropriate working temperature range, and ensure the electrical performance of the IGBT module is stable. Reduce the influence of thermal stress on the device, extend the service life of the IGBT module, improve the reliability and stability of the entire power electronic system, and provide reliable power support and control guarantee for key equipment in various industries.

Product working principle

Heat conduction: When the IGBT module is working, the internal chip generates heat due to the current passing and switching action, and the heat is rapidly transmitted to the heat dissipation substrate through the thermal interface material (such as thermal silicone grease) between the chip and the heat dissipation substrate. Because the heat dissipation substrate has a high thermal conductivity (aluminum alloy is about 100-200 W/(m·K), copper alloy can reach 300-400 W/(m·K)), the heat can spread rapidly in the substrate, so that the temperature of the area in contact with the cooling pipe increases, thus forming a temperature difference between the pipe and the substrate.

Liquid cooling cycle: The coolant flows into the cooling pipe from the water inlet of the water cooling plate under the action of the circulating pump. Due to the temperature difference between the pipe and the heated substrate, heat is transferred from the substrate to the coolant through the pipe wall, so that the coolant temperature rises and becomes a hot coolant. The hot coolant flows along the pipe and eventually flows out of the water cooler from the water outlet into the external radiator for heat dissipation.

Heat dissipation: In an external radiator, the hot coolant dissipates heat by heat exchange with the air. The radiator usually uses a large area of cooling fins and fans to force convection to increase the contact area and heat exchange efficiency between the coolant and the air, so that the coolant temperature is reduced and the coolant is changed back to a low-temperature coolant. The cryogenic coolant is then transported back to the cooling pipe of the IGBT water cooling plate by the circulating pump to begin the next round of cooling cycle, so reciprocating, continuously taking away the heat generated by the IGBT module, maintaining the low temperature operating state of the IGBT module, ensuring its stable work, and avoiding problems such as performance degradation, failure and even damage caused by overheating.

Product features and advantages

Efficient heat dissipation performance: The IGBT water-cooled plate adopts optimized pipe design and high thermal conductivity materials, which can quickly and effectively transfer a large amount of heat generated by the IGBT module to the coolant, achieving efficient heat dissipation. Compared with the traditional air-cooled heat dissipation method, under the same heat dissipation conditions, the operating temperature of the IGBT module can be reduced by 20-30 ℃ or even more, which significantly improves the heat dissipation efficiency, effectively meets the heat dissipation requirements of the high-power IGBT module during high-load operation, and ensures its stable and reliable working state. Improve the performance and reliability of the entire power electronic system, reduce the power loss caused by overheating, switching characteristics and other problems, and provide strong support for the efficient drive of new energy vehicles and the stable operation of industrial equipment.

Accurate temperature control: Through the reasonable design of the cooling pipe diameter, wall thickness, spacing and coolant flow rate, flow rate and other parameters, the IGBT module temperature can be accurately controlled, the temperature fluctuation is controlled in a very small range. This is crucial for some temperature-sensitive IGBT application scenarios, such as high-precision power electronic equipment, electric vehicle motor control systems, etc., to ensure that IGBT modules work in a stable temperature environment, ensure the consistency and stability of its electrical performance, and improve the control accuracy and reliability of the system. Reduce the risk of parameter drift and failure caused by temperature changes, provide reliable heat dissipation protection for advanced equipment in high-tech fields, and promote the development and application of related technologies.

Compact structure design: The IGBT water-cooled plate is compact in structure, occupies small space, and is easy to be integrated into a variety of complex power electronic equipment. Whether it is a new energy vehicle power system with limited space, a miniaturized industrial control cabinet, or a power transmission equipment with high requirements for compact layout, it can be easily adapted, providing strong support for the miniaturization and integrated development of equipment. At the same time, the compact structure is also conducive to reducing thermal resistance, improving heat dissipation efficiency, and will not cause too much interference to the layout and functional realization of other components inside the equipment, which helps to improve the overall performance and reliability of the equipment, meet the requirements of modern equipment for high performance and small volume, and expand the application range of IGBT modules in different fields.

High reliability and stability: The product is made of high-quality materials, and the cooling substrate and cooling pipe have good corrosion resistance, mechanical strength and tightness. Coolant circulation system pumps, pipes and joints and other components are also strictly screened and tested, can be long-term stable operation in harsh working environment, such as high temperature, high humidity, strong vibration and other environmental conditions, still maintain excellent heat dissipation performance, reduce the risk of equipment shutdown due to cooling system failure, improve equipment availability and maintenance. Reduce operating costs and maintenance workload. In addition, the structural design of the water-cooled plate is optimized to effectively resist thermal stress and mechanical stress, avoid deformation, cracking and other problems due to long-term use, further ensure the reliability and stability of the product, provide a solid backing for the stable operation of the IGBT module, ensure the reliable operation of key equipment in various industries, and promote the stable development of the industry.

Low noise operation: Compared with traditional air-cooled radiators, IGBT water-cooled plates produce extremely low noise during operation. Because it mainly relies on the natural convection of the coolant and the low-speed fan of the external radiator (even without the fan in some efficient cooling designs) for heat dissipation, the large noise generated by high-speed fan rotation in the air-cooled radiator is avoided, providing a quiet operating environment for noise-sensitive application scenarios (such as the cockpit of electric vehicles, indoor industrial equipment, etc.). Improve the user experience and work efficiency, but also in line with the development trend of modern equipment for low noise design, conducive to the promotion and application of equipment in more environments, improve the market competitiveness of products and user satisfaction.

Strong scalability: The design parameters of the water-cooled plate can be flexibly adjusted according to the heat dissipation requirements of different IGBT modules, such as the layout, size of the cooling pipe and the parameters of the coolant circulation system, which can easily meet the heat dissipation requirements of low-power to high-power IGBT applications. With the continuous development of IGBT technology, the power density continues to increase, by increasing the number of cooling pipes, optimizing the arrangement, improving the flow rate of coolant and heat dissipation capacity, can realize the effective heat dissipation of higher power IGBT module, and provide a broad space for heat dissipation solutions for the performance upgrade and technological innovation of power electronic equipment. With strong adaptability and scalability, it can keep up with the pace of IGBT technology development, meet the changing market demand, and provide continuous heat dissipation technical support for the technological progress of various industries.

FAQ

Q: What is IGBT water cooling plate?

A: The IGBT water-cooled plate is a cooling device that uses water as a cooling medium and is specially used to cool insulated gate bipolar transistors (IGBTs) to maintain their stability and reliability under high power operating conditions.

Q: Why water cooling rather than air cooling or other cooling methods?

A: Water cooling has higher heat transfer efficiency and can more effectively manage the heat generated by high-power IGBTs while operating with less noise, which is suitable for applications with strict temperature control requirements.

Q: What is the working principle of IGBT water cooling plate?

A: The IGBT water cooling plate works by circulating through the internal waterway, absorbing the heat generated by the IGBT, and then transferring the heat to the external coolant, which releases the heat into the environment through the cooling system.

Q: What are the advantages of IGBT water cooling plates?

A: Advantages include efficient heat dissipation, low noise, long life, good stability and the ability to adapt to high power density.

Q: How to design IGBT water cooling plate?

A: The design needs to consider the IGBT power, thermal resistance, coolant flow rate, waterway design, material selection and system sealing.

Q: What are the production processes of IGBT water cooling plate?

A: The production process includes key steps such as raw material processing, waterway design, welding, air tightness testing, surface treatment and final inspection.